William Oswald received the B.S. degree in computer engineering and the M.S. degree in electrical engineering from the University of South Alabama, in 2020 and 2021, respectively. He is currently pursuing the Ph.D. degree in systems engineering. He has worked in industry as a Systems Analyst at Packaging Corporation of America, from 2019 to 2020. His research interests include computer architecture design, machine learning, and model based systems engineering.